Qualcomm and Qijing Optoelectronics focus on the development of 3D depth sensing photographic systems

Qualcomm, a leading provider of mobile chipsets, recently announced a partnership with Himax Technologies, Inc., a U.S.-listed imaging IC design firm, to expedite the development and commercialization of high-resolution, low-power active 3D depth-sensing photography systems. This collaboration aims to enhance computer vision functionalities across various applications, including biometric facial recognition, 3D reconstruction, and diverse platforms like mobile devices, IoT ecosystems, surveillance systems, automotive solutions, augmented reality (AR), and virtual reality (VR). The joint effort brings together Qualcomm's SpectraTM technology and computer vision expertise, along with Qijing Optoelectronics' advanced wafer optics, sensing, driving, and module integration capabilities, offering a comprehensive structured light module group (SLiMTM) 3D sensing solution. As per Qualcomm, SLiMTM is a one-stop-shop for a complete 3D camera module, delivering high-precision depth sensing and 3D point cloud generation in both indoor and outdoor settings. Its ultra-low power design, compact form factor, and small footprint make it ideal for embedded and mobile devices. Jim Cathey, Senior Vice President at Qualcomm and President of Asia Pacific and India, expressed enthusiasm about this collaboration: "This partnership underscores our ongoing commitment to Taiwanese tech firms and reinforces our position as innovators in visual processing. By collaborating with Qijing Optoelectronics, we aim to introduce groundbreaking products in the region, fortify the global 3D depth-sensing ecosystem, and fuel economic growth in the area." According to Wu Bingchang, CEO of WonderVision, "Our SLiMTM 3D sensing solution represents a revolutionary advancement in the industry. We’re thrilled to bring this technology to the Android ecosystem, offering unprecedented user experiences for the next generation of mobile consumers. Our four-year collaboration with Qualcomm has been focused on meeting rising demands for computer vision capabilities, introducing innovative features and applications across multiple markets." For context, SLiMTM 3D Sensing Solutions are anticipated to enter mass production in Q1 2018 and are expected to find widespread adoption across various sectors. The image accompanying this article was sourced from the official WonderVision website. (Featured Image Source: WonderVision Official Website)

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