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Qualcomm and Qijing Optoelectronics focus on the development of 3D depth sensing photographic systems
Qualcomm, a leading developer of mobile phone processors, has announced a partnership with Himax Technologies, a U.S.-listed imaging IC design firm, to expedite the development and commercialization of high-resolution, low-power active 3D depth-sensing photography systems. This collaboration aims to enhance computer vision functionalities across various applications, including biometric facial recognition, 3D reconstruction, and diverse sectors like mobile devices, IoT ecosystems, security surveillance, automotive industries, as well as augmented reality (AR) and virtual reality (VR) experiences.
The joint effort brings together Qualcomm's SpectraTM technology and expertise in computer vision architecture and algorithms, alongside Qijing Optoelectronics' advanced capabilities in wafer optics, sensing, driving, and module integration. Together, they offer a fully integrated structured light module group (SLiMTM) as a comprehensive 3D sensing solution.
SLiMTM represents a one-stop-shop 3D camera module solution capable of delivering high-resolution, precise depth sensing and 3D point cloud generation in both indoor and outdoor settings. Its ultra-low power design, compact form factor, and small size make it particularly suitable for embedding into portable and embedded devices. The SLiMTM 3D sensing solution is anticipated to commence mass production in the first quarter of 2018 and is expected to find applications across numerous industries.
Jim Cathey, Qualcomm's Senior Vice President and President of Asia Pacific and India, emphasized, "This collaboration with Qijing Optoelectronics underscores our ongoing commitment to Taiwanese companies and reinforces our leadership in visual processing innovation. By licensing and partnering with industry leaders like Qijing Optoelectronics, we aim to foster innovative product developments in the Taiwan region while strengthening the global 3D depth sensing ecosystem and contributing to regional economic growth."
Wu Bingchang, CEO of WonderVision, added, "Our 3D sensing solution marks a transformative technology shift in the industry. It will empower Android smartphones with new possibilities and deliver cutting-edge user experiences to the next generation of mobile users. Our collaboration on SLiMTM 3D sensing solutions has spanned over four years, driven by the growing demand for computer vision functions and the need to introduce novel features and use cases across a broad spectrum of markets and applications."
For those interested in visualizing this innovative technology, an image showcasing the SLiMTM solution can be found on the official WonderVision website. (Image source: WonderVision official website)
As the tech landscape evolves, partnerships like these between Qualcomm and Qijing Optoelectronics continue to push boundaries, promising exciting advancements in how we interact with digital content and physical spaces alike.