EMC/EMI integrated solution and design experience sharing - Power Circuit - Circuit Diagram

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With the rapid advancement of electrical and electronic technologies, household appliances are becoming increasingly popular and electronic. Similarly, the fields of radio, television, telecommunications, and computer networking are experiencing unprecedented growth. These developments have created a more complex and challenging electromagnetic environment. Consequently, engineers and manufacturers are placing greater emphasis on the working conditions of equipment and are focusing more on the impact of electromagnetic environments on electronic devices. Electromagnetic interference (EMI) and electromagnetic compatibility (EMC) have become critical considerations in the design and manufacturing of electrical and electronic products. To assist engineers in addressing the EMC/EMI challenges faced during product design and application, the Electronic Component Technology Network has successfully hosted seven sessions of EMC technology seminars. These seminars have featured experts in the field of EMC/EMI who have discussed market trends, technological advancements, and cutting-edge applications. Attendees had the opportunity to engage in interactive Q&A sessions, where they could discuss real-world EMC/EMI design challenges and ESD protection issues with the experts. This summary provides an overview of the key technical highlights from these seminars. At the 7th Circuit Protection and Electromagnetic Compatibility Symposium, held at the Shenzhen Convention and Exhibition Center on April 8th, numerous leading domestic and international manufacturers presented solutions for EMC/EMI. Below are the highlights from the presentations by the experts: Dr. Zhao Yang, Chief Engineer at Suzhou Taisite Electronic Technology Co., Ltd., delivered a talk titled "Comprehensive Solution for Electromagnetic Compatibility Issues" (download the speech PPT by clicking here). Renowned expert and respected educator Tao Xianfang presented "Design Engineer EMC Experience Sharing" (download the speech PPT by clicking here). Fan Weijun, Senior Product Engineer at Murata (China) Investment Co., Ltd., spoke on "EMC Solution for Improving Cell Phone Sensitivity" (download the speech PPT by clicking here). Electrostatic protection (ESD) is a crucial aspect of ensuring the reliability of electronic systems. Engineers designing electromagnetic protection circuits must clearly identify which components in the system require protection. Identifying the core components that are most vulnerable to interference is essential. Once the protected circuits are identified, engineers must conduct detailed ESD analyses to determine the nature of the static electricity and its impact on the system. Based on this analysis, appropriate ESD protection measures and devices must be selected. Dr. Zhao Yang emphasized in his comprehensive solution for electromagnetic compatibility issues that conductive ESD protection primarily involves using protective devices like ceramic capacitors, varistors, and TVS tubes. These devices form a protection circuit at the front end of sensitive devices to guide or dissipate static currents. Radiation ESD protection focuses on minimizing the generation and energy of static electric fields. This is achieved through structural improvements and protecting sensitive lines. One effective method explored in practice is creating an equipotential surface by properly grounding the casing, thereby suppressing discharges. This approach has proven both effective and easy to implement. General methods for ESD protection include:
  • Reducing static electricity accumulation;
  • Insulating products to prevent static electricity buildup;
  • Providing branch paths to shunt static currents away from sensitive lines;
  • Shielding circuits in discharge areas;
  • Minimizing loop areas to protect circuits from magnetic field interference caused by ESD.
From the perspective of electromagnetic induction, community teacher Tao Xianfang believes that a good electronic product must not only meet functional requirements but also excel in circuit design (ECD) and electromagnetic compatibility design (EMCD). The quality and technical performance of the product are heavily influenced by these aspects. While many engineers begin their careers with an understanding of electronic components, they often struggle when transitioning to electromagnetic compatibility design. The foundation of EMC design lies in electromagnetic field theory, specifically electromagnetic induction knowledge. Consider a scenario where multiple electronic devices operate in the same space, generating electromagnetic fields around them. These fields can interfere with each other through conduction or radiation, potentially destabilizing the system or causing crashes—the root cause being electromagnetic interference (EMI). EMI is prevalent in electronic products, arising not only from interactions between devices but also between components within a system. The two primary modes of interference are conducted and radiated, with conducted interference further subdividing into common mode and differential mode interference. The causes of interference are complex, with electrostatic discharge interference being central. Ensuring system stability in the absence of external influences requires adherence to a three-step rule for improving design efficiency and solving electrostatic discharge interference comprehensively. To mitigate radiation interference, three key strategies are: 1. Shielding; 2. Minimizing the area of current loops (to reduce magnetic field interference) and the length of live conductors (to reduce electric field interference); 3. Avoiding resonance conditions where the length of the conductor matches an integer multiple of the quarter-wavelength of the interference signal, as this maximizes radiation interference. Common EMI suppression methods include shielding, spread spectrum techniques, and filtering. Most electromagnetic shielding methods target noise above 300 MHz. Additionally, using composite materials such as vacuum-plated plastics with nickel coatings is a common approach to isolate electromagnetic waves. The spread spectrum technique involves spreading the clock signal to reduce peak signal amplitudes and levels. Some BIOS systems now offer built-in spread spectrum functionality, allowing users to adjust settings themselves. However, achieving the right balance between signal distortion and EMI attenuation is crucial, typically ranging from 1% to 1.5%. Exceeding 3% can distort signals excessively, rendering the approach impractical. Filtering is the most commonly used method among design engineers due to its low cost and ease of implementation via SMD processes. Filters are tailored based on specific control requirements. For instance, a large current bead can be employed on power traces, while general beads suppress specific frequency noise signals. CMFs are used to manage differential mode noise on lines like USB, 1394, and LVDS. The effectiveness of any solution depends on the context; if it works, it’s a good method. Addressing radiation-conducted EMI presents a significant challenge, with several solutions: 1. Adding an LC filter circuit at the interference source; 2. Introducing noise to ground via bypass capacitors on the I/O side; 3. Shielding electromagnetic waves with enclosures; 4. Expanding the PCB area; 5. Using flat cables or solid wires sparingly within products; 6. Twisting internal physical wires to suppress noise radiation, adding bypass capacitors at the I/O ends of flat cables; 7. Adding a Common Mode Filter at the beginning or end of differential mode signal lines; 8. Adhering to analog and digital wiring principles. EMI formation can be categorized into common mode and differential mode radiation. Common mode radiation includes common ground impedance interference and electromagnetic field interference to wires. The former arises from shared ground resistance between noise sources and victim circuits, solved by avoiding common interference. The latter results from high electromagnetic energy fields affecting inter-device wiring, addressed through shielding. Differential mode radiation refers to interference between wires, where noise from one wire infects others, creating near-field interference. This can be mitigated by increasing the distance between wires. In the "EMC Solution for Improving Handset Sensitivity," Murata experts highlighted how modern electronic products are evolving with higher performance, leading to complex changes in electronic devices. Mobile phones, for instance, feature lower IC voltages, reduced energy, and faster interface communication speeds. Additionally, the growing number of electronic controls in automotive applications has increased system complexity. These factors make addressing EMC challenges increasingly important. As the market evolves, so do safety and testing trends. IEC categorizes electromagnetic compatibility standards into three types: basic standards, general standards, and product standards. Basic standards divide into emission and immunity standards. General standards classify environments into classes A and B, with A representing industrial zones and B civilian. Knowing which standard applies is critical. If a product lacks a specific EMC standard or applicable product class standard, the general EMC standard should be used. A product standard is preferable, followed by selecting the most relevant standard. Shou Jianxia, Secretary General of the National Radio Interference Standardization Technical Committee, discussed the latest international and domestic EMC standards, recent developments, and testing industries at the Circuit Protection and Electromagnetic Compatibility symposium in Shanghai. In the Chengdu station of the event, the Electronic Component Technology Network invited European EMC technology and standards expert Dr. Gerd Jeromin to focus on European radio and communication equipment EMC challenges, system solutions, and methods, as well as European standards and testing. Click to watch: EMC Standards and Wireless Communication Device Planning and Application Trends.

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