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Performance and fever are the same: mobile phone manufacturers are giving the phone a "fever"
As the scorching summer approaches, mobile phones tend to overheat, making gaming experiences particularly challenging. Even just browsing the web can feel like your device is overheating and protesting against the heat. This is especially noticeable in environments exceeding 40 degrees Celsius. Excessive heat not only damages the phone but also significantly impacts the user experience. Mobile phone manufacturers are well aware of this issue, and they’ve been investing heavily in advanced cooling technologies. Today, let’s explore some of the current heat dissipation methods available.
Before diving into these technologies, it’s important to understand why mobile phones overheat. The primary sources of heat come from two areas: the SOC chip and the heat generated during charging and discharging. The amount of heat produced by the chip largely depends on the design capabilities of the chip manufacturer. As chips become more powerful and integrated, it's natural for them to generate heat during operation. However, manufacturers should ensure that this heat remains within an acceptable range. If there are significant design flaws, overheating can become a serious issue.
For instance, the Qualcomm Snapdragon 810 is a prime example of poor thermal management. Many mobile phone manufacturers struggled with this chip due to its excessive heat output, which was caused by a critical flaw in its internal process design. Additionally, how mobile phone manufacturers optimize chip performance plays a crucial role. Take Sony Z3+ as an example; its camera would often overheat after just a few shots, forcing the system to shut down. Although this wasn’t a major design flaw, it still highlighted Sony’s shortcomings in managing heat. Now, let’s take a closer look at how other manufacturers are addressing this issue.
**1. Graphite Patches**
This is perhaps the most commonly used cooling method and is widely adopted by many manufacturers. A layer of graphite heat-conducting film is applied to the SOC of the phone. This graphite helps dissipate heat to the back cover and other heat-dissipating parts of the frame when the phone heats up. While metals generally offer better thermal conductivity than plastics, providing faster heat transfer, they also make the phone feel hotter to the touch.
**2. Frost Cooling Technology**
Frost cooling is a proprietary mobile phone cooling technology developed by OPPO for their OPPO R5. It introduces a new liquid metal heat-dissipating material, allowing the phone to quickly and evenly discharge heat generated during normal operation. Frost cooling required a novel approach to PCB board design. Since the heat-conducting medium is a liquid-metal-like material, conventional PCB designs would risk short circuits near the CPU and other ICs. Therefore, OPPO opted for a single-sided layout, placing the liquid metal behind the CPU and other major heat-generating components. Once the temperature rises, the liquid metal transitions from a solid to a liquid state, filling the gaps with the middle frame, eliminating air pockets, and improving heat transfer efficiency. Compared to traditional cooling methods, this approach significantly enhances the phone’s heat dissipation.
**3. Active Cycle Nano Thermal Fluid**
This cooling method employs an active circulation mechanism. A copper hollow tube is added to the phone, and a special nano thermal fluid is introduced into the tube. When the phone's chip generates heat during computation, the thermal energy is absorbed by the nano thermal fluid inside the copper tube. As the fluid heats up, it vaporizes and flows through the hollow conduit. When it reaches cooler areas, the heat energy is released, condensing back into a liquid state, completing the rapid transfer and dispersion of heat. The condensed thermal fluid then circulates back to key heat-generating components like the AP and BP.
**4. Software Optimization**
Compared to hardware optimizations, software optimization is more of a workaround. This approach is widely adopted by many manufacturers and typically incorporated into their custom mobile operating systems. By controlling background applications and improving execution efficiency, the CPU’s workload is reduced, thus lowering heat production. Additionally, the CPU frequency can be moderately decreased, sacrificing some performance but ensuring a smoother user experience. Under these conditions, this method proves to be quite effective.
Looking ahead, we expect mobile phone chips to continue advancing, leading to even greater heat generation. However, we remain optimistic that technological progress will yield better cooling solutions. Imagine a future where you can play demanding games or run multiple apps without worrying about your phone overheating. At that point, smartphones will not only be more performant but also more secure and reliable. Let’s look forward to that day.
In conclusion, while current cooling technologies provide some relief, ongoing innovation will be essential to meet future demands. Mobile phone manufacturers must stay ahead of the curve to ensure optimal performance and user satisfaction.