Vishay's new device is the first in a new family of enhancements

New audio jack detectors and low voltage analog switches are the first products in the family to feature enhanced packaging

Vishay Intertechnology, Inc. introduced the audio via detector DG2592 and the low voltage dual SPDT analog switch DG2750 in an ultra-thin 1.4mm x 1.8mm miniQFN10 package with a thickness of 0.35mm to replace the larger miniQFN10 commonly used in portable applications. WCSP devices achieve space saving. The new Vishay Siliconix DG2592 Audio Hole Detector and DG2750 Low Voltage Dual SPDT Analog Switch are the first devices in a new family of reinforced packages.

Vishay's new device is the first in a new family of enhancements



The typical miniQFN10 and WCSP are 0.55mm high, while the DG2592 and DG2750 ultra-thin miniQFN10 packages are 36% thinner than the first two packages, saving valuable PCB space and allowing designers to design thinner end products, including handheld Healthcare instruments, smartphones, tablets, portable media players, digital cameras, and wearable Internet of Things (IoT) devices. Compared to the WCSP package, the enhanced miniQFN10 is easier to surface mount and is more suitable for flexible PCB boards commonly used in portable products. This package is environmentally superior to current RoHS standards and is completely lead-free.

The DG2592 is an audio jack detector and plosive control switch chip with an integrated circuit that detects the presence of stereo headphones with a microphone and SEND/END control buttons. The device operates from 1.6V to 5.5V, with a maximum quiescent current of 10μA and a maximum resistance of 1.2Ω at 1.8V. The MIC bias switch quickly discharges and clamps. The detector's ESD resistance reaches 8kV (human body model).

The DG2750 is a low-resistance bidirectional device that switches the negative swing audio signal without the need for a coupling capacitor. The analog switch operates from a 1.8V to 5.5V power supply and delivers audio signals with very low distortion in both directions. The device is fabricated in sub-micron CMOS low-voltage process technology with very low quiescent current and latch-up protection greater than 600mA to meet per JESD78 requirements.

Samples of the DG2592 and DG2750 are available now, with volume production scheduled for the first quarter of 2016, with lead times of 13 to 14 weeks for larger orders.

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